A new report claims that Apple will remove 3.5mm headphone port in iPhone 7 to adopt lightning wired headphones. This step will allow Apple to make next-generation iPhone 1mm thinner than compared to iPhone 6s, But the screen shape and radius will remain similar so that iPhone will be once again thinnest smartphone by Apple. But this reduction will limit users from using headphones with 3.5mm headphone jack which is the standard of the world and headphones will only connect through the lightning connector or through Bluetooth. 

The report says it's a difficult task to reduce the size of 3.5mm port because it is a world standard, iPod touch is already 1mm thinner than iPhone while it is still using 3.5mm port, but it doesn't have Sim module that occupies a lot of space. 

Apple made efforts to bring 2.5mm port to iPhone many years ago, but customers response was against to anything other than 3.5mm port. But the idea of removing or reducing the headphone port was alive in Apple's head but the company was waiting for alternate headphone connection technologies to attract users mind so that they could implant them in the future devices but till then they kept producing devices with 3.5mm port. 

Last year Apple introduced lightning headphone, but the number of shipped lightning headphones was very few.

The source also claims that Apple has the full plan to remove headphone port so the Phone 7 package will include a lightning earbuds that will connect in lightning port, the connector will contain a tiny Digital to Analog (DA) converter. And in order to let iPhone 7 use third-party headphone, headphone maker will have to include the lightning cable or 3.5mm port to the lightning connector with their headphones. But Bluetooth headphone will have no effect with this step. Apple could include Bluetooth earbuds or something like that to the iPhone package instead of the wired earbuds.

How many of you are OK with this change?

Also check out a report says  iPhone 7 could also include 3GB of RAM.
Sorce: Macotakara

Apple is planning to use OLED displays in 2018 for iPhones, According to Nikkei. Apple has notified their display suppliers about their future display plan in order to make them ready for production, LG is already providing OLEDs for Apple Watch and readying its self for production capacity upgrade for OLEDs Display.

The report claims LG Display and Samsung Electronics will be the main provider of OLED displays for future iPhones. Apple's step toward OLED display will be a huge loss for Japanese Companies that are currently producing LCD displays for Apple and earning a huge amount of profit.

Apple ships a lot of iPhones, the technical issues of OLEDs forcing the company to continue selling iPhones integrated with LCD display panels alongside models featuring new OLED display.

Apple is using LCD displays since the first iPhone launched eight years ago, But the competitors are using the cutting edge OLED display technologies which are sharper, brighter and power efficient than the LCD displays, but they offer shorter display life and costs way more than LCDs. Apple is working hard to eliminate cons of OLED displays as Apple wants to introduce better display than existing displays.

Previously, Ming-Chi Kuo of KGI Securities shared that Apple is not adopting OLED display at least for next three years because of a report claiming that Apple is adopting AMOLED display for iPhone 7. Kuo also claimed that Apple's largest supplier Foxconn is investing in advanced TFT -LCD production lines in China for mass production in 2018.

If not OLED display, Apple has to upgrade iPhone 7 with a better display that could be an innovation through LCD or may be just a number upgrade.

Do you want OLED display in your next iPhone?

Synaptic received orders from Apple to provide display drivers for iPhone 7, indicates that Apple is still not gonna produce their own Touch and Display Driver Integration (TDDI) for their iPhones, says Taiwanese website DigiTimes.

In past Synaptics acquired Renesas Sp Drivers, the company used to supply LCD driver ICs for iPhone, The company struggled to keep getting orders from Apple and finally they are getting their business. Renesas Also works with other smartphone makers including Samsung, Sony, Google, Microsoft, HTC and more.

Apple reportedly set Renesas engineers to secretly develop TDDI chips with integrated Touch ID sensor in the display. This technology can let Apple eliminate home button or may allow them to integrate it within the screen. Currently, Apple ordered the regular TDDI chips but the technology can hit the market through future iPhones.

Apple in past few years filled a lot of patents for displays with integrated Touch ID and trackpad capabilities, but the iPhone 7 is not getting the technology, future iPhones can get but not until iPhone 8 or later, but it's still not confirmed.

Synaptics back in March announced the first ever TDDI Single-chip  that can work with smartphones and tablets both, The TDDI chip makes display thinner and brighter and gives better Touch experience. Reduced number of components decrease the manufacturing cost and let Company's yield more profit?

Do you love home button on your iPhone?

Whenever Ming-Chi Kuo of KGI Securities made a prediction it turns out true later, just like every year Kuo has released a new research report which predicts for Apple's 2016 iPhone 7 and iPhone 7 Plus and a 4-inch A9 powered iPhone, Maybe iPhone 6c.

Kuo predicts Next year iPhone will feature 3GB of RAM which is 50 percent more than the RAM in iPhone 6s and iPhone 6s Plus. A10 chip will power iPhone 7 and iPhone 7 Plus. however, Kuo says this time Apple will make a difference between 4.7-inch iPhone  and 5.5-inch iPhone by giving the extra gig of RAM only to 5.5-inch iPhone 7 Plus and 4.7-inch iPhone 7 will retain 2GB of RAM. Kuo also said next year iPhone 7 and iPhone 7 Plus will have a revamped design. Kuo expects new A10 chip will be exclusively manufactured by TSMC. Apple is also expected to make next-generation iPhone more light weight and 6mm thin.

Kuo says Apple is still working on 4-inch iPhone and Apple could launch its new 4-inch iPhone in early 2016. New 4-inch iPhone will not support 3D Touch just to make it different from iPhone 6s and iPhone 6s Plus. Kuo says Apple is expecting to ship 20-30 Million new iPhones until the end of 2016. Moreover, New 4-inch iPhone will have a metal exterior and it will feature the same A9 processor, Maybe RAM also (Not Confirmed). But Kuo also says 4-inch iPhone will be similar to upgraded iPhone 5s.

Recently a rumor told that next-generation iPhone could have Samsung's OLED display and another rumor also suggested that Intel will power LTE modem for next-generation iPhone.

Do want a 4-inch upgraded iPhone? Thoughts on iPhone 7?

Apple is already using the OLED display for Apple Watch, Samsung could get orders for larger OLED displays for next-generation iPhone.

Apple is currently testing the OLED displays for next-generation and integration depends upon the results.

According to the report, Samsung shipped first samples of OLED displays for testing which hints Apple is planning to integrate Samsung's OLED curved Displays in future iPhones, may be in iPhone 7.
Apple is not ready to fit the OLED curved display in next iPhone but making their mind to integrate. Although Samsung's Super AMOLED display is the best display in the market.

There is no surprise Samsung is trying to become display supplier for Apple because earlier this year Apple Watch OLED display deal of LG and Apple was done in estimated 1.4 Trillion alone for twenty fifteen. Samsung trying its best to get as much production as it can get from Apple.

Samsung is swallowing all manufacturer's business about which other manufacturer are worried.
I think it will be great and everyone out there love Samsung's display.

I am sure you also want this in iPhone 7

VentureBeat reported, Intel's special team based on 1,000 employees working to build LTE Modem chips for next-generation iPhone. But Intel may supply its 7360 LTE modem chip to Apple for next generation iPhone.

Intel hopes to provide its LTE modem for at least some of the iPhones in 2016. Current iPhone 6s and iPhone 6s Plus are powered by Qualcomm's 9X45 LTE chip, nearly all Apple product's modems come from Qualcomm.

Intel's new LTE modem "7360 LTE" could start shipping for next-generation iPhone later this year while the manufacturers will start implementing them in 2016. Intel considers this partnership as its key for future of mobile space. Apple demands in bulk with large-scale production which arises the need for more then 1,000 employees team.

Apple has done the deal, but importantly Apple is still making sure that intel could meet the demand before signing the agreement. But another reason could be Apple planning to go more deeper than LTE Modem chips from Intel.

Another report claims that Apple would create a system on a chip for next generation iPhone that will combine both Ax chip and LTE modem chip and this step could provide huge performence boost including better speed, better battery life.

Yet Apple is using 20-nanometer processor produced from both TSMC and Samsung, but Intel's chip will be made from 14-nanometer process, Intel is also working on 10-nanometer chip and Apple is quite interested.

Apple is sending engineers to work with Intel on the project.

After having a lots of rumors finally a report say something about the Apple's iPhone 6s and iPhone 6s Plus Launch, A report from Buzzfeed say that Apple is set to unveil its new iPhone on Wednesday, 9th September. Buzzfeed is always been good at revealing event dates.

Today another report from Ming-Chi Kuo told thatApple will start the mass productions of the upcoming iPhone 6s and iPhone 6s in the end of the August, but a Central News Agency of Taiwan claims that Apple will start the production after 1-2 weeks later than the date previously Ming-Chi Kuo told us, This may become a hurdle in future, But however this will not affect the launch date of the Next-Generation of iPhone, Which is mid-September as its Companies tradition from many previous years.

Manufacturing is divided in Foxconn and Pegatron on the basis of 60% and 40% respectively, while "iPhone 6s Plus" will be only Manufactured by Foxconn.Components of the upcoming iPhones like A9 Chipset, Pressure sensitive display and other parts are already in production, now what Foxconn and Pegatron just have to do is "Assemble".

As Demands for Apple's iPhones are increasing every year, So it's also reported that some of Foxconn's factories are offering over time to workers and employees, So that there will be no shortage of iPhone for customers.It's also reported that Apple is slowing down the iPhone 6 production to boost the production of upcoming iPhone.

We have received many rumors claiming that Next iPhone will feature 12-megapixel camera and display that can recognize harder and lighter tap on screen called " Force Touch ", A9 Chipset, 2GB of RAM and 7000 series aluminum that can eliminate "bendgate and may be 0.2mm thicker iPhone.

Are you concern if iPhone launches late ?

As we are getting closer to the Launch of new iPhone we are also  having so many new rumors and leaks which tell us more about the upcoming new iPhone. And today, nearly two months before the launch of the iPhone 6s we have received a leaked iPhone 6s front panel.

The new leaked front panel of iPhone 6s is no different from the existing iPhone 6's front panel and we know "S" upgrade don't have any noticeable design changes.


And the report shows that only front panel of iPhone 6s Gold and white unit are under production and ready for delivery to assemblers.

The Source is disable to tell us about the Features of the front panel either it has Force touch or Sapphire screen or nothing.

We have received many rumors previously which tells us about no 16GB model, a new upcoming color, a 12-megapixel camera, 2GB Ram and 7000 series aluminum shell and we are still expecting to see many new leaks.

Do you want more rumors?

Source: NowWhereeles.fr

A schematic from Engadget japan indicates at iPhone 6S dimensions, the image doesn't look so realistic but data in it is already proved to be confirmed, As we seen many previous rumors saying the exact Dimension.

The change in thickness will be unnoticeable, The schematic says 7.1mm of thickness which is 0.2mm more as compared to the current iPhone 6  6.9mm. The upcoming thickness of iPhone 6S will be similar to the current iPhone 6 Plus's thickness.The reason for this thickness is the addition of Force Touch.

The schematic suggest that there is only thickness change in iPhone 6S, no wider and no taller. The thickness change is so minor that existing accessories will make no difficulty to fit on the new iPhone.

We have already received a bunch of rumors for iPhone 6S including 12-megapixel camera upgrade, 2 Gigs of RAM upgrade, a new color option "Rose Gold", 7000 series Aluminium and The mighty Force Touch Technology.There are also rumors for iPhone to have more than 128GB iPhone storage model.

Are you OK with 0.2mm thicker iPhone?

Source: macrumors

As reported iPhone 6S to have Force Touch display and supercharged camera, In addition it will have Qualcomm's new LTE Chip that will provide 2x faster data speed and a new NFC chip and new chips that will be efficient or smaller in quantity and the base model will remain 16GB.

The prototype image received by 9to5mac and chipworks of iPhone 6S is compared with the existing iPhone 6's motherboard.


In new iPhone 6S's prototype logic board a new NFC chip is observed labelled 66VP2 from NXP compared to the older 66V10 NFC processor present in the current iPhone 6. There is no information about the capabilities of the new 66VP2 NFC chip, First NFC chip in iPhone was used in iPhone 6 in 2014 which was used for Apple pay and the chip was not modern but the spotted one seems to be the cutting edge one.

The size of the new logic board is observed to be smaller as Apple is reducing the quantity of chips, As the board that was previously consist of 10 components now consist only 3 components, while the size is reduced and efficiency is increased. Now upcoming iPhone will offer the similar faster performance but will possess less power consuming parts.

It seems that Apple will preserve a Cirrus Logic audio chip, a Murata Wi-Fi module, and wireless power amplifiers from RFMD, TriQuint, Avago and Skyworks within the iPhone 6S. Although the prototype includes what seems to be similar Bosch and InvenSense accelerometer and gyroscope parts to the iPhone 6, A tiny new alternative from STMicroelectronics could replace it on the final logic board, having launched in the Apple Watch.

In this age of world where data is so advanced and heavy also, thats why16GB model does not fulfil the requirements of the users. According to the chipworks the Toshiba Flash storage shown in the prototype is the same as present in the iPhone.Its still unclear that iPhone will have 16GB base model or larger, because in prototype they use as low storage as they can.


We have also received a report regarding the external design of the upcoming iPhone "S" model, The upcoming iPhone will be identical to the existing iPhone 6 with changes that are not visible to human eye and its been said that the most of the iPhone 6 accessories will support iPhone 6S. Report says that the iPhone 6S will be 0.2mm thicker than the iPhone 6S and chang will be such a minor that apple will not even change it in technical specs.


 And the iPhone also taller and wider than the iPhone 6, 0.16mm and 0.13mm respectivelya and these increases are due to the addition of Force Touch panel.

Source: 9to5Mac

A internal document leaked by Foxconn employee on Chines micro blogging site Weibo, The rumor was observed by PhoneArena, The rumor says that the next iPhone will feature a 12-megapixel camera and 4K video recording with 240 FPS slow-motion recording.

User "KJuma" who uploaded the document on Social network has deleted from the Social network, but till then the document become common on web. The document shows the code name of iPhone 6s and iPhone 6s Plus "N66" and "N71" respectively and will feature 2 Gigs or RAM.

Ming Chui the analyst of KGI Securities issued a note in which he predicted many upcoming changes and feature of iPhone and the note shed lights 12-megapixel camera upgrade, 2GB of RAM, another color option for iPhone and much more.

Source: MacRumors

Apple is trying to deal with Samsung to provide Flash Storage for Next generation of iPhones, Currently Apple is taking Flash storage from Toshiba, SK hynix and SanDisk. The report indicates that Apple is also planning to increase storage capacity for its next iPhone.

As Apple is currently offering 16GB, 64GB and 128GB iPhone models, Todays report hints that Apple could finally kill the 16GB model and could add 32GB model in the lineup as a entry level model and According to this report Apple is also planning to add a model that will have more memory then 128GB that could be 256GB or less but more then 128GB.

Currently both companies are negotiating over price and shipment, Samsung is also testing its chips for durability and stability, Apple used have storage from Samsung but due to price concerns deal was ended, But Apple is again efforting to reach to a deal.

Few months ago Apple Dealed with Samsung for providing A9 chips for iPhone, But in past few years Apple start taking chips from TSMC due to issues in companies.

Do You want an iPhone with more then 128GB Storage ?

People out there who want flexible iPhone, you are not very much far from getting your desire, But not so fast. But a report from South Africa shows, Apple is pretty much wondering to launch its first iPhone with a flexible OLED display but as far as in 2018 and Apple is working on this project.

The viewpoint that Apple could be working on the release of an an OLED smartphone which might appear as an opponent of Samsung and LG have been exhibiting subsequently from 2013 is not unbelieveable and especially since Apple began utilizing OLED displays for the Apple Watch.

As indicated by a report in the start of the year, Foxconn's new $2.6 billion plant devoted to building especially for Apple's  OLED display supply for future iPhones and wearable, with the inclusion of LCD displays used in previous iPhones. Apple's finest display supplier, LG Display, additionally plans to move one of its LCD lines in its Gumi production line into an OLED line with a perspective of Producing OLED displays in 2017.

We have seen Apple making plenty of patents fold bendable and foldable iPhones. demonstrating that this is a project the  not precisely unwilling to investigate. One patent distributed in January reported about a flexible iPhone which could be twisted or even turned in folds without spoiling hardware.

Today's report makes us sure that Apple has pretty much interest in OLED displays and Appel is concerned with its displays, current LCD week points can be resolved with OLED, for example: saturation, exactness, and brightness.

do you want a iPhone with OLED ?

source : cultofmac

Apple is currently in the search of forming a single-chip solution for combination of both the touchscreen and display drivers for mobile devices on one chip, for this purpose, Apple is working within its organization without any coordination from outside, this information is shared by Taiwanese DigiTimes. (TDDI) touch and display driver integration chips comes with an inclusion of "integrated fingerprint sensors", which is quite effective could be end for Apple's Iconic Home button.

"Apple is internally developing touch and display driver integration (TDDI) single-chip solutions for its iPhones, according to sources in Taiwan's IC design industry. 

The TDDI single-chip solutions will also come with integrated fingerprint sensors, said the sources. The integrated design would fit into future iPhone designs – models with ultra-thin and ultra-narrow displays, and with a whole plane design eliminating the Home button."

TDDI has come with a quantum leap in industry, a first such solution has been introduced through Synaptics in start of this year. New TDDI chips have been invented through synaptics and they have created the chips with acquisition of chipmaker Renesas SP Drivers, uniting touch technology chipset with Renesas display technology. Apple tried to acquire Renesas SP Drivers the previous year but deal couldn't reach to end.




It has been seen Synaptics will get acquestion Renesas SP Drivers and through its TDDI chips, Apple tried to become synaptic acquired for the second time, But todays report has shown some exciting news As Apple is working to produce the technology for itself.

It has been indicated by DigiTimes that Apple's answers to the problems and solutions can allow the abolition of the old conventional and old-fashioned iOS device home button which is followed by combination of its functionality into device's screen about which Apple has investigated in the last patent applications.This will give Apple a go ahead to produce iPhones with larger displays with very less bezels or Apple could simply make iPhone smaller with current sizes.

source : macrumors

Ming-Chi Kuo an anlsyst of KGI Securities issued a note to people who invest in Apple, The note's copy was gain by Mac Otakara, The note tells a rumor that next iPhone will be thicker due to the Force Touch hardware and the iPhone will adopt the Apple Watch Sport like 7000 series Aluminium and first time there will be a change in dimensions of the Apple updated "S" model of iPhone and the dimension were shown in the report.

The report shows that the new upcoming iPhone will be 0.15mm taller and wider to compensate with the 7000 series aluminum that will make it more strong and durable, The upcoming feature Force Touch will make it about 0.2mm thicker, these change in dimensions will be quite unnoticeable.

Few weeks ago Kuo also issued a report in which he talked about many upcoming features of iPhone claiming that next iPhone will feature 2 Gigs of Rams and updated processor and after a long time updated 12-megapixel camera and a whole new Rose Gold color in Mobile phone industry and Apple will make current space grey color more black.

Source: MacRumors